TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.
Key Features & Benefits
TIA225GF Potential Applications
Thermal interface for electronic components in consumer, telecommunications, automotive, and lighting applications.
Packaging
TIA225GF(B): 25kg pail
TIA225GF(A): 25kg pail
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