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TIA265GF(XE14-D0034)

TIA265GF(XE14-D0034)

Gap Filler Adhesive & Sealants Thermal Management 

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  • Product Description
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SilCool TIA265GF (XE14-D0034) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. TIA26GF can be used as liquid dispensed alternative to pre-fabricated Thermal Pads, for a broad array of thermal designs in electronic applications.

Key Features

  • High thermal conductivity
  • Fast, low temperature cure
  • Convenient 1:1 mix ratio by weight
  • Retains softness after cure to contribute to stress relief during thermal cyclin
  • Good slump resistance (stays in place)
  • Repairable
  • Typical Operating Temp Range -40° to 150°C

Applications

Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.

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