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TGX450

Gap Filler Adhesive & Sealants Thermal Management 

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  • Product Description
  • TDS/MSDS
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TGX450 is fully cured, single component, reworkable, cross-linked silicone thermal gel that can be used for high thermal applications. This product dispenses for filling gaps of varied thicknesses, encompassing superior long- term thermal stability and reliability. The product can be tailored from low to high flow, with the aid of solvent if needed.
TGX450

Key Features and Typical Benefits

  • High thermal conductivity; Electrically insulative
  • 1 Part (Easy to use)
  • Vertical position stability (when dispensed on surface and sandwiched)
  • Does not require curing

Potential Applications

  • Thermal interface materials between dies and heat spreaders
  • Microprocessors, GPUs & multichip modules

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