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TIS420C

Adhesive & Sealants Gap Filler Thermal Management 

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  • Product Description
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TIS420C is a one component thermally conductive gap filler from Momentive Performance Materials. This thixotropic paste cures at room temperature to become a mechanically stable silicone gel. Due to its curing perforamnce, TIS420C provides improved stability in 3-dimensional and vertical TIM applications thatrequire a stress-absorbing, pump-out resistant, mechanically stable and repairable heat path.

TIS 420C was designed for use on thermal interfaces for electroni components in consumer and automotive applications.

Product Benefits

  • High thermal conductivity
  • Physical stability due to polymerisation during cure process
  • Soft, stress-absorbing post cure properties
  • Can be dispensed in various thickness
  • Conforms to intricate shapes and component designs
  • Use within a broad operating temperature range
  • Repairable

Technical Properties

Colour: Grey

  • Dielectric Strength: 5.0 kV/0.25mm
  • Thermal Resistance: 20 mm2.K/W
  • Thermal Conductivity: 4.2 W/(m.K)

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