About EQX Global Group
At EQX Global Group, we believe in sustainable bonding solutions that not only connect businesses but also create a positive impact on people and the planet. Our corporate story is built on the foundation of purpose and our commitment to the Sustainable Development Goals (SDGs) and Environmental, Social, and Governance (ESG) principles.
Contact Us
- PMT 1159, Lorong Perindustrian Bukit Minyak 22, Penang Science Park, Taman Perindustrian Bukit Minyak, 14100 Simpang Ampat, Pulau Pinang, Malaysia
- (604) 5057883, 5057885, 5057886
TIS420C
TIS420C is a one component thermally conductive gap filler from Momentive Performance Materials. This thixotropic paste cures at room temperature to become a mechanically stable silicone gel. Due to its curing perforamnce, TIS420C provides improved stability in 3-dimensional and vertical TIM applications thatrequire a stress-absorbing, pump-out resistant, mechanically stable and repairable heat path.
TIS 420C was designed for use on thermal interfaces for electroni components in consumer and automotive applications.
Product Benefits
- High thermal conductivity
- Physical stability due to polymerisation during cure process
- Soft, stress-absorbing post cure properties
- Can be dispensed in various thickness
- Conforms to intricate shapes and component designs
- Use within a broad operating temperature range
- Repairable
Technical Properties
Colour: Grey
- Dielectric Strength: 5.0 kV/0.25mm
- Thermal Resistance: 20 mm2.K/W
- Thermal Conductivity: 4.2 W/(m.K)
Certificates
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