About EQX Global Group
At EQX Global Group, we believe in sustainable bonding solutions that not only connect businesses but also create a positive impact on people and the planet. Our corporate story is built on the foundation of purpose and our commitment to the Sustainable Development Goals (SDGs) and Environmental, Social, and Governance (ESG) principles.
Contact Us
- PMT 1159, Lorong Perindustrian Bukit Minyak 22, Penang Science Park, Taman Perindustrian Bukit Minyak, 14100 Simpang Ampat, Pulau Pinang, Malaysia
- (604) 5057883, 5057885, 5057886
MOLD RUBBER CLEANING SHEET C60-K
MOLD RUBBER CLEANING SHEET C60-K
Cleaning mold stains (epoxy resin, organic residues) remaining on mold die surface and in deep cavities
during transfer molding process of semiconductor device encapsulation.
“Key-Efficiency-Cleaning” C60-K is the newest developed grade of C60 family, and it significantly improves the cleaning ability for the most challenging objects, which are:
-Deep and narrow mold cavity
-Mirror Cr-plated mold die
-Sticky green epoxy molding compound
C60-K is compatible with a wide range of molding cavity designs, provides excellent cleaning performance and renders high production efficiency for semiconductor manufacturing.
FEATURES
Ultimate cleaning performance.
100% fused filler to prevent the molding die surface from mechanical abrasion.
Environmental friendly formulation of water-soluble compositions, and light smell.
Ultimate cleaning for green compounds.
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