About EQX Global Group
At EQX Global Group, we believe in sustainable bonding solutions that not only connect businesses but also create a positive impact on people and the planet. Our corporate story is built on the foundation of purpose and our commitment to the Sustainable Development Goals (SDGs) and Environmental, Social, and Governance (ESG) principles.
Contact Us
- PMT 1159, Lorong Perindustrian Bukit Minyak 22, Penang Science Park, Taman Perindustrian Bukit Minyak, 14100 Simpang Ampat, Pulau Pinang, Malaysia
- (604) 5057883, 5057885, 5057886
MOLD CONDITIONING SHEET W80-K
MOLD CONDITIONING SHEET W80-K
For recovering the releasing ability of mold-die surface, normally after cleaning cycle during transfer molding process of semiconductor device encapsulation with epoxy molding compounds.
W80-K is supplied in sheet form, does not require dummy lead frames, and is able to evenly spread lubricants on mold cavity surface by compression molding.
Formulated with multiple releasing technologies, W80-K is approved compatible with the majority of various epoxy molding compounds, and provides sustained releasing performance.
Utility is optimized when apply W80-K combined with TECORE® C-60 cleaning sheet*.
FEATURES
Good filling for small cavity
100% fused filler to prevent the molding die surface from mechanical abrasion
Environmental friendly formulation of water-soluble compositions, and light smell
Exclusive releasing ability for green molding compounds
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