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KTMC-5000

Epoxy Molding Compound Film Assist Moulding 

Low Stress Grade

  • Product Description
  • TDS/MSDS
  • Related Information

KTMC for Next Generation of Memory are specially designed for the advanced package trend in the future such as Flip Chip, Warpage Free Low-K, Cu & Au material and Compression moiding, etc., They show high performance as per the needs of next generation packages.

Application

  1. Surface Mounted Device
  2. High Density IC
  3. Memory Device
  4. Power Module (Heat sink)

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