GT-700WO enables the sawing type QFN/DFN package low warpage performance with the

minimized CTE (Coefficient of Thermal Expansion) mismatch to silicon chip and copper leadframe.

Rely on its high adhesion to metal lead frame and silicon chip, and low water absorption,

GT-700WO provides the package high reliability to MSL2~MSL1@260degC.

It maintains white color and high reflectance, with endurance to high temperature (i.e. 260degC

reflow), UV and oxidation.

MAIN FEATURES 

Low warpage for sawing QFN/DFN

High reliability up to MSL2~1@260degC

High reflectance and whiteness with anti-oxidation by heat